Electron Beam Welding
Low HAZ ｜ Deep Penetration ｜ High Vacuum Sealing ｜ Dissimilar Material Welding
High-Precision Deep Penetration Welding in Vacuum Environment
◆ What is Electron Beam Welding?
Electron Beam Welding (EBW) is an advanced joining technology that uses a high-energy focused electron beam under high vacuum conditions to melt and fuse metal materials.
The highly focused electron beam delivers extremely high energy density with minimal heat affected zone (HAZ), low thermal distortion, deep penetration capability, and exceptional welding precision.
EBW is suitable for stainless steel, aluminum alloys, titanium alloys, molybdenum, copper, and dissimilar material joining applications.
The technology is widely used in semiconductor equipment, vacuum chambers, aerospace components, medical devices, and high-precision industrial manufacturing.
◆ Electron Beam Welding Principle
EBW accelerates electrons under high voltage and focuses them into a concentrated beam directed at the workpiece surface.
When the electron beam strikes the material, kinetic energy is converted into thermal energy, instantly melting the localized area to form a weld pool.
Due to the extremely high energy density, EBW can achieve deep penetration welding within a very narrow area while minimizing thermal deformation.
The vacuum environment prevents electron scattering and oxidation contamination, ensuring superior weld quality and material purity.
Importance of Vacuum Environment：
Vacuum Welding Environment (10⁻⁴ to 10⁻⁶ Torr)
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Prevent Electron Scattering
Maintains beam focus stability by preventing collisions between electrons and air molecules.
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Zero Oxidation Protection
Eliminates oxygen and nitrogen contamination to prevent oxidation of reactive metals such as titanium and zirconium.
Reduces porosity, inclusions, and welding defects while improving weld reliability.
◆ Technical Advantages
Maximum penetration depth up to 300 mm in steel materials.
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Extremely Small Heat Affected Zone (HAZ)
Fast cooling and minimal thermal distortion.
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High Precision Processing
Suitable for micron-level precision welding applications.
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High Vacuum Sealing Performance
Leak rates can reach ≤10⁻⁹ Pa·m³/s for semiconductor vacuum systems.
No filler material required, ensuring material consistency.
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Dissimilar Material Joining
Suitable for Mo/Stainless Steel and Cu/Titanium Alloy welding.
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Low Distortion and High Strength
Weld strength comparable to base material while maintaining dimensional stability.
◆ Electron Beam Welding System - Equipment Specifications
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Item
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Chamber Size
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3,000 × 2,500 × 2,000 mm
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Working Distance
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X 1625 mm ,Y 475 mm ,Z 600 mm
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Beam Power
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15 kW
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Accelerating Voltage
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150 kV
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Vacuum Level
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< 7 × 10⁻⁴ mbar
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Welding Speed
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1 – 30 mm/s
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Control System
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Multi-axis CNC Automation
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◎Equipment Features
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High repeatability
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Precision path control
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Stable vacuum system
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Suitable for large and precision workpieces
High-vacuum chambers, gas flow structures, heater modules, and semiconductor process components.
Jet engines, rocket motor housings, and high-strength structural components.
High-cleanliness and precision medical metal joining applications.
Low-distortion precision gear and transmission component welding.
◆ Semiconductor Application Cases
Semiconductor Vacuum Chambers
Semiconductor chambers require ultra-high vacuum sealing and thermal fatigue resistance.
EBW enables oxidation-free welding of stainless steel and aluminum alloy structures with heat affected zones below 0.3 mm.
Typical applications include:
• Vacuum chambers
• Sealing flanges
• Flow channel covers
• High-vacuum structures.
Rotary Sputtering Targets
Rotary sputtering targets consist of high-purity coating materials bonded onto high-strength carrier tubes with internal cooling structures.
EBW enables high-strength, low-stress, contamination-free metallurgical bonding.
Applicable materials:
• Molybdenum (Mo)
• Aluminum (Al)
• Copper (Cu)
• Titanium (Ti)
• ITO
• Stainless Steel
• Titanium Alloys
Key features:
• Dissimilar material welding
• HAZ below 1 mm
• High-strength bonding
• Inclusion-free joints
Semiconductor Heater Plates
Semiconductor heater plates are widely used in CVD, ALD, and etching processes.
EBW provides high-strength autogenous welding structures while minimizing cracking during thermal cycling.
The process also enables precise embedded heater wire structures for improved temperature uniformity.
Semiconductor Shower Heads
Shower heads require highly consistent hole diameters and uniform gas flow distribution.
EBW enables low-distortion joining between perforated plates and main structures while preventing microcracks and channel collapse.
Technical specifications:
• Hole tolerance ±5 µm
• Low heat input
• Burr-free structure
• Leak rate ≤10⁻⁹ Pa·m³/s
Electrostatic Chuck(ESC)
ESC systems are widely used in PVD, etching, and ion implantation equipment.
EBW provides precision welding for stainless steel and aluminum alloy structures with superior flatness and ultra-low leak rates.
Technical advantages:
• Leak rate up to 10⁻¹⁰ Pa·m³/s
• HAZ < 0.5 mm
• Surface flatness ≤10 µm
• High structural strength
Power Micro EBW Advantages
• High-vacuum electron beam welding technology
• Semiconductor equipment manufacturing experience
• Precision CNC automation control
• Dissimilar material joining capability
• Customized precision processing services
• High reliability and repeatability
For project evaluation, pilot tests, and ROI analysis, contact Power Micro International Company to arrange trials and obtain technical reports.
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