Electron Beam Welding (EBW) | High Vacuum Precision Welding Solution-Advanced Welding for Semiconductor Components, Vacuum Chambers and Dissimilar Materials

Electron Beam Welding (EBW) is a precision welding technology that uses a focused high-energy electron beam to fuse materials under a high vacuum environment.

Under vacuum conditions (10⁻⁴–10⁻⁵ mbar), the electron beam maintains high ऊर्जा density and stability, enabling:

  • Extremely small Heat Affected Zone (HAZ)

  • High aspect ratio welding (up to 20:1)

  • Oxidation-free and contamination-free joining

  • High-strength metallurgical bonding

It is particularly suitable for semiconductor vacuum components and precision structures.


◆ Equipment Specifications

  • Chamber Size: 3,000 × 2,500 × 2,000 mm

  • Working Range:

    • X: 1625 mm

    • Y: 475 mm

    • Z: 600 mm

  • Beam Power: 15 kW

  • Acceleration Voltage: 150 kV

  • Vacuum Level: < 7 × 10⁻⁴ mbar

  • Welding Speed: 1 – 30 mm/s

  • Control System: Multi-axis CNC automation

Designed for high precision, repeatability, and industrial-scale production.



◆ Key Advantages of EBW

1. Minimal Heat Affected Zone (HAZ)
HAZ can be reduced to <0.3 mm, minimizing distortion.

2. High Aspect Ratio Welding
Up to 20:1 depth-to-width ratio for deep penetration.

3. Oxidation-Free Welding
Performed under vacuum to eliminate contamination.

4. Autogenous Welding
No filler material required, ensuring material integrity.

5. Dissimilar Material Joining
Suitable for Mo/SS, Cu/Ti and other combinations.


Vacuum Chamber

Used in etching chambers and flow channels requiring:

  • Leak rate < 1×10⁻⁹ Pa·m³/s

  • High thermal fatigue resistance


Rotary Sputtering Target

Applicable materials: Mo, Al, Cu, Ti, ITO

Enables:

  • High strength bonding

  • Impurity-free joints

  • Precise metallurgical bonding


Heater Plate

Used in CVD, ALD and etching processes

Features:

  • High temperature resistance (>500°C)

  • Embedded heater structure

  • Crack prevention under thermal cycling


Shower Head

  • Hole tolerance: ±5 µm

  • Burr-free

  • No deformation

Ensures uniform gas distribution.


ESC

  • Leak rate: 10⁻¹⁰ Pa·m³/s
  • Flatness: ≤10 µm
  • Particle reduction: ~70%


◆ Importance of Vacuum Environment

Vacuum (10⁻⁴–10⁻⁶ Torr) ensures:

  • No beam scattering

  • Stable energy concentration

  • Zero oxidation contamination


◆ Industries

  • Semiconductor equipment
  • Aerospace

  • Automotive

  • Medical devices



Q1: What materials are suitable for EBW ?

EBW is suitable for a wide range of metals, including:

  • Stainless steel
  • Aluminum alloys
  • Titanium alloys
  • Copper
  • Molybdenum

It is especially effective for dissimilar material joining, such as:

  • Mo / Stainless Steel
  • Cu / Titanium


Q2:What is the difference between EBW and laser welding?

Item
EBW
Laser Welding
Environment
Vacuum
Atmospheric
Penetration
Very deep
Moderate
HAZ
Minimal
Medium
Weld Quality
High purity
Possible oxidation
Application
Semiconductor, aerospace
General industry

Q3:Why is vacuum required in EBW?

Vacuum (10⁻⁴–10⁻⁶ Torr) ensures:

  • No beam scattering from air molecules
  • High energy density and focus
  • No oxidation or contamination
  • Stable and high-quality welding


Q4:What are the key advantages of EBW?

  • Extremely small HAZ (<0.3 mm)
  • Minimal distortion
  • High aspect ratio (up to 20:1)
  • No filler required (autogenous welding)
  • Clean and contamination-free weld

  • Q5:What semiconductor components use EBW?

    Typical applications include:

    • Vacuum chambers
    • Sputtering targets
    • Heater plates
    • Shower heads
    • Electrostatic chucks (ESC)


    Q6:Does EBW cause distortion?

    Due to its highly concentrated energy and minimal heat input,
    EBW significantly reduces distortion compared to conventional welding.


    Q7:Is EBW suitable for high vacuum sealing applications?

    Yes, EBW can achieve:

    • Leak rate ≤ 10⁻⁹ ~ 10⁻¹⁰ Pa·m³/s

    Suitable for semiconductor and high-vacuum applications.



    Electron Beam Welding (EBW) delivers high-energy density welding under vacuum conditions, effectively overcoming limitations of conventional welding in distortion control, sealing performance, and material contamination.

    In semiconductor and precision manufacturing industries, EBW provides:

    • High vacuum sealing performance (≤10⁻⁹ Pa·m³/s)
    • Minimal heat affected zone and distortion
    • Oxidation-free, high-purity weld quality
    • Reliable dissimilar material joining
    • Improved component lifespan and process stability

    For critical components such as vacuum chambers, sputtering targets, heater plates, and gas distribution systems, EBW has become a key enabling technology.



    Power Micro International Company offers integrated precision manufacturing and surface engineering solutions to support high-reliability welding applications.



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