The ceramic bonding head tool is one of the most critical components in semiconductor thermo-compression bonding (TCB) processes.

By combining micro-particle mirror polishing, SP³ diamond coating, and anti-sticking surface treatment, we effectively minimize solder adhesion and maintain excellent thermal conductivity and surface purity under high temperatures.

It precisely applies both heat and pressure to reflow solder between the chip and substrate, ensuring reliable joint formation.

However, during continuous production, solder residue and surface adhesion can lead to inconsistent bonding quality, surface damage, and frequent maintenance.

◆ Technical Principle

The bonding head incorporates a built-in heating module that evenly transfers heat to the contact surface, maintaining a stable temperature between 200°C and 450°C.

Simultaneously, pressure is precisely controlled by pneumatic or servo systems, ensuring accurate force application at the micron level.

To prevent solder contamination and wear on the ceramic surface during high-temperature bonding, the following multilayer treatment is applied:

1. Micro-Particle Polishing – Ceramic materials (Al₂O₃, AlN, SiC) are polished to a nano-level smoothness (Ra < 0.04 μm).

2. SP³ Diamond Coating – An ultra-hard carbon layer (Hv ~6500) protects the mirror-finished surface from scratching during tungsten-brush cleaning.

3. Anti-Sticking Coating – Featuring a high contact angle (~110°), the coating suppresses solder adhesion and oxidation at elevated temperatures.

This triple-layer structure provides high thermal conductivity, superior wear resistance, and outstanding anti-sticking performance.

◆ Semiconductor Packaging Processes

Applied in TCB (Thermo-Compression Bonding), Flip-Chip, BGA / LGA, Wafer-Level Packaging (WLP), and Mini/Micro LED bonding.

Case Example:

● After adopting our technology, one packaging line extended bonding head tool lifetime by 2.5× and reduced solder residue by 80%.

● Cleaning frequency decreased from 3 times per day to once per week, significantly improving production stability and yield.

◆ Advantages and Limitations

Category	Advantages	Limitations
Surface Quality	Mirror finish (Ra < 0.04 μm) for stable heat transfer	Time-consuming polishing process
Coating Performance	SP³ diamond structure (Hv ~6500) resists scratching	Higher cost compared to standard ceramic heads
Anti-Sticking Effect	Reduces solder adhesion by 80%, improving yield	May not suit extremely high-viscosity solders
Maintenance & Lifetime	Fewer cleaning cycles, extended tool life	Requires specialized coating equipment

Frequently Asked Questions (FAQ)

Q1：What is SP³ diamond coating and how does it differ from DLC?

SP³ diamond coating contains a high ratio of sp³-bonded carbon atoms, giving it hardness close to natural diamond. It provides superior wear and anti-sticking performance compared to conventional DLC coatings.

Q2：What is the function of the anti-sticking layer?

The anti-sticking layer prevents solder adhesion during high-temperature bonding, maintaining surface cleanliness and reducing maintenance frequency.

Q3：Does the coating affect heat transfer efficiency?

No. Diamond coatings possess high thermal conductivity, and the coating thickness is only several hundred nanometers, ensuring efficient heat transmission.

Q4：Which materials are compatible with this process?

The treatment is applicable to ceramic materials such as Al₂O₃, AlN, and SiC, with customizable coating structures based on tool requirements.

Q5：How does cost compare to conventional methods?

While coating costs are higher, the extended lifetime and reduced downtime deliver a much better overall cost-performance ratio.

◆ Comparative Insight

Compared with traditional uncoated ceramic bonding heads, this technology maintains a cleaner surface and more consistent thermal transfer during high-temperature bonding —
ideal for continuous semiconductor packaging and high-precision chip attachment processes.

Conclusion & Contact 

This case integrates three key technologies — micro-particle mirror polishing, SP³ diamond coating, and anti-sticking surface treatment —effectively solving long-standing issues of solder adhesion and maintenance in bonding head tools, while improving production yield and reliability.

◆  Contact Power Micro International Company，to learn more about our advanced surface engineering solutions for semiconductor applications.   LINE Official Account  

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